AVS 46th International Symposium
    Thin Films Division Tuesday Sessions
       Session TF-TuA

Paper TF-TuA6
AC Reactive Sputtering of Dielectric Films using a Dual Magnetron

Tuesday, October 26, 1999, 3:40 pm, Room 615

Session: Fundamentals of Si and Dielectric PVD
Presenter: A. Belkind, Stevens Institute of Technology
Authors: A. Belkind, Stevens Institute of Technology
J. Cai, Stevens Institute of Technology
R. Scholl, Advanced Energy Industries, Inc.
Correspondent: Click to Email
DC reactive sputtering to produce dielectric films suffers from two problems: Arcing on the target surface and covering the anode (the 'disappearing anode problem'). Both problems have received serious attention in recent times. One way to solve both simultaneously is to apply ac power between two magnetrons. Although this approach was first suggested more than ten years ago, and has been widely implemented, a detail investigation of it is remains lacking. In this work, ac reactive sputtering from a dual magnetron system is studied. The effects of ac frequency and discharge current on reactive sputtering of aluminum oxide using both balanced and unbalanced magnetrons are investigated. Special attention is given to ion bombardment of a substrate, both electrically floating and connected to the power supply system.