This presentation will be an overview of the multi-disciplinary research program at the NSF/SRC Engineering Research Center involving a team of researchers from six universities. The Center is focusing on a dual approach to the environmentally benign semiconductor manufacturing. The first approach involves the development of novel processes where environmental, safety, and health (ESH) factors are among the primary design parameters together with performance and cost. The second approach focuses on improving the existing processes for ESH gain. Several examples of the thrust areas and projects of the Center will be discussed. In particular, the following topics will be covered in depth: Reduction of water and chemical usage for surface preparation and wafer cleaning; Environmental gains in the development of new low-k materials/processes as well as the new etch and deposition methods; Waste reduction and recycling in the CMP process; Energy use reduction through novel purification processes; Application of simulation and integrated modeling for recycle and reuse optimization in selected fab processes. Finally, the educational program of the Center that focuses on including the ESH subject in the core engineering curriculum will be discussed briefly.