AVS 46th International Symposium
    Manufacturing Science and Technology Group Tuesday Sessions
       Session MS-TuM

Invited Paper MS-TuM3
The IC Interconnect Millenium Transitions; Al to Cu, SiO@sub 2@ to Low-K

Tuesday, October 26, 1999, 9:00 am, Room 611

Session: New Manufacturing Research Paradigms
Presenter: K.A. Monnig, SEMATECH
Authors: K.A. Monnig, SEMATECH
A.C. Diebold, SEMATECH
Correspondent: Click to Email
This paper will give a general overview of the transitions occurring in I.C. interconnect systems today; Al conductors with SiO@sub 2@ insulators are planned to be supplanted by Cu metal with Low-K dielectrics. The reasons why this transition is happening now will be outlined. Almost all of the fabrication processes used will be changed and these differences will be reviewed. Special attention will be given to vacuum processing applications that will be lost due to the changes and to the new opportunities created. An assessment of financial and technical risks will be shown. Finally a current status report on the progress of the various transitions will be presented.