AVS 46th International Symposium
    Manufacturing Science and Technology Group Tuesday Sessions
       Session MS-TuM

Invited Paper MS-TuM1
Proposal of New Paradigm LSI Structures and Their Manufacturing

Tuesday, October 26, 1999, 8:20 am, Room 611

Session: New Manufacturing Research Paradigms
Presenter: T. Ohmi, Tohoku University, Japan
Authors: T. Ohmi, Tohoku University, Japan
M. Hirayama, Tohoku University, Japan
Y. Shirai, Tohoku University, Japan
Correspondent: Click to Email
UCS (Ultra Clean Society) was established in October, 1988 and is going to finish its mission at the end of September, 2000. For these 11 years, UCS has developed many new technologies mainly focussing on an improvement of process quality by removing unknown factors from manufacturing such as contaminants (particles, metals, organic molecules, moisture molecules, native oxides, surface micro-roughness, electrostatic charge-up and etc.) and fluctuations of process parameters giving an influence on process results. Consequently, semiconductor processes can be understood in a scientific manner, resulting in an improvement of process reproducibility. Developments of very well regulated high density plasma source for RIE, sputtering and plasma CVD, and room temperature 4 steps substrate surface cleaning have drastically improved process quality and process reproducibility. Equipment individuality has been overcame by introducing RF circuit specification to the process chamber and very well regulated process gas supply to the wafer surface by newly developed Flow Control System, so that so that process recipe can be applied to all other identical process chambers resulting in a complete process reproducibility and a low price process equipment. Right now, very high throughput and very compact manufacturing line must be established having a capability of simplified process steps, very low consumption volume of electricity and resource materials down to 1/10. Complete process reproducibility will make it true the computer simulation of all processes by microprocessors. Process flow and process conditions will be derived by computer simulation just after the completion of LSI design. Manufacturing of newly designed LSI will start immediately without using pilot wafers. Very low cost and very QTAT manufacturing are crucial for coming networked digital home electronics era. New society will focus on these issues.