AVS 46th International Symposium
    The Science of Micro-Electro-Mechanical Systems Topical Conference Wednesday Sessions
       Session MM-WeA

Invited Paper MM-WeA1
Micro-Science and Tribology

Wednesday, October 27, 1999, 2:00 pm, Room 620

Session: Micro-Science and Tribology
Presenter: L. Lin, The University of Michigan
Correspondent: Click to Email

Microelectromechanical Systems (MEMS) have emerged as an interdisciplinary field in recent years and encompassed a wide range of scientific and engineering areas such as electrical engineering, mechanical engineering, material sciences, physics and chemistry. Tribological issues dealing with adhesion, abrasion, corrosion and erosion are generally encountered in macroscopic machinery and are inevitable problems for micro-science. The technological and economical impacts of tribological issues in MEMS demand fundamental understanding and characterization in material development, design, processing and testing of microstructures. Micro devices that are fabricated by IC (Integrated Circuit) processes represent very different surface features than those macro structures fabricated by conventional mechanical manufacturing processes. It is important to study the micro-science of tribology and investigate the tribological effects in the microscale for optimal design and processing of MEMS. This talk will present several important tribological effects, including surface roughness of the microstructures to the nucleation of micro thermal bubbles, to the mechanical properties and to the optical properties of microstructures. The causes and solutions of the surface force induced sticking failures in MEMS will be discussed. A review of MEMS micromachining processes describing key manufacturing steps is followed by practical engineering examples. Future research directions will be proposed in the conclusion.