AVS 46th International Symposium
    Applied Surface Science Division Monday Sessions
       Session AS2-MoA

Paper AS2-MoA4
Thin Film Characterization through combined X-ray Photoelectron Spectroscopy (XPS) and X-ray Diffraction (XRD)

Monday, October 25, 1999, 3:00 pm, Room 6A

Session: Applied Surface Science for Microelectronics
Presenter: D.J. Surman, Kratos Analytical Inc.
Authors: D.J. Surman, Kratos Analytical Inc.
S. Bates, Kratos Analytical Inc.
C.J. Blomfield, Kratos Analytical Inc., UK
A.J. Roberts, Kratos Analytical Inc., UK
J.E. Fulghum, Kent State University
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Traditionally there has been a range of methodologies applied to the analysis of thin films, centering on the use of XPS combined with sputter profiling. This approach provides both elemental and chemical information for each of the layers within the film. Following calibration with standard materials, a measure of the sputter rate can be obtained allowing allowing film thickness estimations to be made. It is well known however that different materials sputter at different rates and therefore it is difficult to obtain accurate measurements of individual layer thickness without extensive calibration. X-ray Diffraction (XRD) offers new possibilities for the characterization of thin films. Recently developed poly-capillary optics enable the generation of intense parallel beams of X-rays. This X-ray beam can then be used at grazing angles to provide a range of additional information on the nature of the thin film. This methodology allows accurate film thickness measurements to be obtained from monolayer to approximately 2000Å.This can be applied to multi-layer structures, providing an accurate measure of the individual layers enabling in-situ callibration of the sputter profile. The X-ray diffraction pattern also allows the polycrytalline phases within the film to be identified and quantified, providing additional support information for the chemical information provided by XPS. Variation of the diffraction pattern with grazing angle can also be used to obtain a measure of film thickness' of greater than 2000Å. This paper will demonstrate the enhanced characterization that can be achieved through the combined use and interpretation of the XPS and XRD data on a series of different materials and combined thin films.