| AVS 45th International Symposium | |
| Manufacturing Science and Technology Group | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 9:00am | MS-ThM3 RF Monitoring of PECVD Tools in a Manufacturing Environment M.B. Freiler, IBM |
| 9:20am | MS-ThM4 Advances in Broadband RF Sensing for Real-time Control of Plasma-Based Semiconductor Processing C. Garvin, D.S. Grimard, J.W. Grizzle, The University of Michigan |
| 9:40am | MS-ThM5 NOVA In-Line CMP Metrology and Its Use for Lot-to-Lot Process Control T.H. Smith, Massachusetts Institute of Technology, S.J. Fang, J.A. Stefani, G.B. Shinn, Texas Instruments, D. Boning, Massachusetts Institute of Technology, S.W. Butler, Texas Instruments |
| 10:00am | MS-ThM6 In Situ CD Measurement during Post Exposure Bake R.H. Krukar, Bio-Rad Semiconductor, N.T. Sullivan, Digital Semiconductor, S.L. Prins, J.R. McNeil, Bio-Rad Semiconductor |
| 10:20am | MS-ThM7 Invited Paper Process Environment Monitoring of Plasma Etching for Advanced Process Control H. Enami, A. Kagoshima, Hitachi, Ltd., Japan |
| 11:00am | MS-ThM9 Improvement of Process and Equipment Performance Using Online and Real Time Optical Emission Spectroscopy D. Knobloch, Siemens Microelectronics Center GmbH & Co. OHG, Germany, F.H. Bell, Siemens AG, Germany, J. Zimpel, Fraunhofer Institute, Germany, A. Steinbach, Siemens Microelectronics Center GmbH & Co. OHG, Germany |
| 11:20am | MS-ThM10 Multivariate Spectral Analysis of Optical Emission Spectroscopy for use in Low-Open Area Endpoint Detection D. White, B. Goodlin, A. Gower, D. Boning, H. Sawin, Massachusetts Institute of Technology, T. Dalton, Digital Equipment Corporation |
| 11:40am | MS-ThM11 Simulations of the Performance of Novel Ion Current Sensors M.A. Sobolewski, National Institute of Standards and Technology |