AVS 45th International Symposium
    Vacuum Metallurgy Division Monday Sessions
       Session VM+TF-MoM

Paper VM+TF-MoM9
Study of Thin Films Deposited from a Copper Beam Formed in an Argon Atmosphere Capable of Condensing Nanoparticles

Monday, November 2, 1998, 11:00 am, Room 328

Session: Ionized-PVD: Processes, Properties, and Applications
Presenter: F.K. Urban, Florida International University
Authors: F.K. Urban, Florida International University
A. Khabari, Florida International University
A. Housseini-Tehrani, Florida International University
P. Griffiths, Florida International University
G. Fernandez, Florida International University
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Although thin films formed from beams of nanoparticles or clusters have been discussed since the early 1970s, the question of the usefulness of this method has remained open as few films of any significant thickness have been formed to date. Early attempts did not condense, could only condense a few "high vapor pressure" solids, or were so low rate as to make growth too slow to be of use. A new deposition system has been designed and built here along the lines of those of Averback and Haberland, as they appear to have the most promise. The new system was specifically designed for high rate with a high throughput intermediate pressure pump and 2 kW capable sputter source. Preliminary films of copper deposited onto single crystal silicon substrates show a small beam divergence of less than 1 degree total. The beam is highly non-uniform with maximum intensity on-axis, which drops rapidly to zero within less than 10 mm off axis. Deposits have been made using a 1 Torr Argon + Helium sputtering and condensation atmosphere followed by nozzle aperture extraction. Films are affected by the amount of He and by cooling of the sputter chamber walls using liquid nitrogen. Nothing appears (detectable optically) on the substrate using Ar and no cooling and increases in both factors result in films of generally increased thickness. Optically transparent films of copper have been deposited but are not yet understood. SEM, TEM, and AFM results of Cu and other films will be presented.