AVS 45th International Symposium
    The Science of Micro-Electro-Mechanical Systems Topical Conference Monday Sessions
       Session MM+PS-MoM

Invited Paper MM+PS-MoM1
Overcoming Barriers to MEMS Prototyping and Production

Monday, November 2, 1998, 8:20 am, Room 324/325

Session: MEMS Processing and Deep Si Etch Technology
Presenter: D.A. Koester, MCNC
Authors: D.A. Koester, MCNC
K.W. Markus, MCNC
Correspondent: Click to Email
As MEMS continues to grow and expand into new markets, there continues to be a need for low cost proof-of-concept and prototype fabrication. For the past 6 years, MCNC has provided a number of services designed to provide the domestic MEMS community with an array of fabrication and design services intended to help overcome the cost and accessibility barriers to MEMS product development. The cornerstone of this DARPA-supported program, called the MEMS Technology Network (TechNet), is the Multi-User MEMS Processes (MUMPs). MUMPs is a three-polysilicon surface micromachining process offered in a multi-user environment to offset the high cost of fabrication. Since its inception in January '92, MUMPs has fabricated over 1000 designs for more than 140 different R&D groups and has been available to the world-wide community since July of '98. The SmartMUMPS program enables electronics integration of MUMPs by way of flip chip of a standard ASIC designed with a variety of sensing blocks. LIGA technology is also made available through the program. The MEMS Technology Network also provides a spectrum of custom services to the community including deep silicon RIE, backside patterning, stock substrates and access to a Microcosm MEMCAD 4.0 seat.