AVS 45th International Symposium
    Applied Surface Science Division Friday Sessions
       Session AS+VT-FrM

Paper AS+VT-FrM7
Automated Process Monitoring Using ESCA and Numerical Methods

Friday, November 6, 1998, 10:20 am, Room 307

Session: Application of Surface Analysis Techniques to Semiconductor Technology
Presenter: D.J. Hook, Physical Electronics, Inc.
Authors: D.J. Hook, Physical Electronics, Inc.
J.F. Moulder, Physical Electronics, Inc.
J.S. Hammond, Physical Electronics, Inc.
Correspondent: Click to Email
There currently exists a need in the electronics industry for automated process control to increase product yield and reliability. An example of this is the hard disk industries' push to higher media storage density that has placed increasingly stringent requirements on the lubrication media needed for disk surfaces. Similarly, uniformity of oxide thickness on silicon wafers is an important property that can affect the finished device and in turn overall production capability of a semi-conductor facility. The ability to obtain quantitative ESCA results over large areas and present information in an easy to understand visual format can provide feedback for the production environment. The combination of totally automated process monitoring with Graphical User Interface (GUI) driven film thickness calculations and large area mapping software is a new development in ESCA which can address this need. Examples of automatically collected lube thickness measurements on new and used hard disks and oxide thickness maps on cleaned 200 mm silicon wafers will be presented.