| AVS 64th International Symposium & Exhibition | |
| MEMS and NEMS Group | Wednesday Sessions |
| Session MN+2D-WeM |
| Session: | 2D NEMS |
| Presenter: | Jong-Kwon Lee, National Nanofab Center in Korea |
| Authors: | B. Davaji, Marquette University, Cornell University H.D. Cho, Dongguk University J.-K. Lee, National Nanofab Center in Korea T.W. Kang, Dongguk University C.H. Lee, Marquette University |
| Correspondent: | Click to Email |
Since the performance of electronic devices suffers from elevated temperatures as a result of self-heating, outstanding thermal properties of graphene are considered to be suitable for both instrumentation and integrated microelectronic applications [1]. Also, recently developed techniques for fabricating complex graphene structures in micro/nano scale [2, 3] make graphene a great candidate for temperature sensor applications due to its excellent electrical properties, outstanding mechanical strength, and high thermal conductivity.
In this study, micro-fabricated single-layer graphenes on a SiO2/Si, a SiN membrane, a suspended architecture, and a spatially nano-modulated Si substrate are presented for their use as temperature sensors. These graphene temperature sensors act as resistance temperature detectors, showing a quadratic dependence of resistance on the temperature. The observed resistance change of the graphene temperature sensors are explained by the temperature dependent electron mobility relationship (~ T4) and electron-phonon scattering. The transient response analysis of the graphene temperature sensors on different substrates shows that the graphene sensor on the SiN membrane exhibits the highest sensitivity due to low thermal mass, whereas the sensor on SiO2/Si reveals the lowest one. In addition, the graphene on the SiN membrane reveals the fastest response, as well as better mechanical stability in comparison with the suspended graphene sensor. Therefore, we can expect that the graphene temperature sensors with an extremely low thermal mass will be used in various applications requiring high sensitive and fast operation.
References
[1] P. Sun, M. Zhu, K. Wang, M. Zhong, J. Wei, D. Wu, and H. Zhu, ACS Applied Materials & Interfaces 5, 9563 (2013).
[2] M. K. Bless, A. W. Barnard, P. A. Rose, S. P. Roberts, K. L. McGill, P. Y. Huang, A. R. Ruyack, J. W. Kevek, B. Kobrin,
D. A. Muller, and P. L. McEuen, Nature 524, 204 (2015).
[3] Z. Sun, T. Feng, and T. P. Russell, Langmuir 29, 13407 (2013).