AVS 64th International Symposium & Exhibition
    Applied Surface Science Division Thursday Sessions
       Session AS+SS-ThA

Invited Paper AS+SS-ThA6
Advanced Analysis of XPS and ToF-SIMS Data

Thursday, November 2, 2017, 4:00 pm, Room 13

Session: Advances in Instrumentation and Data Analysis
Presenter: Matthew Linford, Brigham Young University
Authors: M.R. Linford, Brigham Young University
S. Chatterjee, Brigham Young University
B. Singh, Brigham Young University
N. Gallagher, Eigenvector Inc.
M.H. Engelhard, EMSL, Pacific Northwest National Laboratory
Correspondent: Click to Email

Surface analysis plays a critical role in many areas of science and industry, and X-ray photoelectron spectroscopy (XPS) and time-of-flight secondary ion mass spectrometry (ToF-SIMS) are much used analytical techniques that provide information about the outermost layers of materials. In this presentation, I discuss the application of multivariate spectral techniques, including principal component analysis (PCA) and multivariate curve resolution (MCR), to the analysis of XPS and ToF-SIMS depth profiles. Multivariate analyses often provide insight into data sets that is not easily obtained in a univariate fashion. The information content (IC) or entropy, which is based on Shannon’s information theory, is also introduced. This approach is not the same as the mutual information/entropy approaches sometimes used in data processing. A discussion of the theory of each technique is presented. PCA, MCR, and IC are applied to four different data sets obtained via a ToF-SIMS depth profile through ca. 100 nm of C3F6 on Si, a ToF-SIMS depth profile through ca. 100 nm of PNIPAM (poly (N-isopropylacrylamide)) on Si, an XPS depth profile through a film of SiO2 on Si, and an XPS depth profile through a film of Ta2O5 on Ta. PCA, MCR, and IC reveal the presence of interfaces in the films, and often indicate that the first few scans in the depth profiles are different from those that follow. Both IC and backward difference IC analysis provide this information in a straightforward fashion. Rises in the IC signal at interfaces suggest greater complexity to scans from interfaces in depth profiles. Results from PCA were often rather difficult to understand owing to the complexity of its scores and loadings plots. MCR analyses were generally more interpretable.