| AVS 62nd International Symposium & Exhibition | |
| Advanced Surface Engineering | Tuesday Sessions |
| Session SE+PS-TuA |
| Session: | Pulsed Plasmas in Surface Engineering |
| Presenter: | Priya Raman, University of Illinois at Urbana Champaign |
| Authors: | P. Raman, University of Illinois at Urbana Champaign I.A. Shchelkanov, University of Illinois at Urbana Champaign J.T. McLain, University of Illinois at Urbana Champaign S. Armstrong, Kurt J. Lesker Company D.N. Ruzic, University of Illinois at Urbana Champaign |
| Correspondent: | Click to Email |
There is an increasing demand for high quality, wear-resistant, low-friction and corrosion resistant coatings in the microelectronics, automotive, tooling and other industries. High power magnetron sputtering is a type of magnetron sputtering technique where short high power pulses are applied to the magnetron target at very low duty cycles leading to higher degree of ionization of the target material. These ionized sputtered material assist in film growth leading to more adhesive, dense, and smoother films compared to conventional DC Magnetron Sputtering (dcMS) techniques. Unfortunately HPPMS suffers from lower deposition rates due to “return effect” of the ionized sputter materials [1]. Further reach of the HPPMS technology largely depends on whether it can produce deposition rates comparable or higher than dcMS. Recent studies of HPPMS discharges have shown that the magnetic field in the region above the sputter target defines the plasma properties and potential distribution in that region. The “ε” magnet pack [2] had already demonstrated increased deposition rates by carefully changing the magnetic field pattern above the target surface. Cylindrically symmetric “TriPIMS” magnet was developed based on magnetic field design solutions from “ε” magnet pack to keep the high deposition rates but improve deposition uniformity. In order to fully understand the behaviour of high current pulsed discharge in this new magnetic field configuration, TriPIMS magnet pack, was tested with Huettinger HiPIMS, Z-pulser MPP, Starfire Impulse and DC power supplies. Plasma parameters (ne, Te, ionization fraction), deposition rate, deposited film density, uniformity, and stress were measured. Reason for higher deposition rate is discussed.
[1] Papa F et al 2011 Thin Solid Films 520.5 1559-1563.
[2] Raman, Priya, et al. "High power pulsed magnetron sputtering: A method to increase deposition rate." Journal of Vacuum Science & Technology A 33.3 (2015): 031304.