| AVS 62nd International Symposium & Exhibition | |
| Advanced Surface Engineering | Tuesday Sessions |
| Session SE+PS-TuA |
| Session: | Pulsed Plasmas in Surface Engineering |
| Presenter: | Vladimir Kudriavtsev, Intevac, Inc. |
| Authors: | V. Kudriavtsev, Intevac, Inc. A. Riposan, Intevac, Inc. D.W. Brown, Intevac, Inc. C. Smith, Intevac, Inc. T. Bluck, Intevac, Inc. |
| Correspondent: | Click to Email |
In this presentation we discuss Linear Scanning Magnetic Array (LSMA) technology for magnetron sputtering in conjunction with in-line substrate processing. In this approach, the magnet array (pole) scans over planar target spreading the erosion pattern in a controlled fashion. Thus, high quality, dense films with good uniformity can be produced at significant advantages over static magnetrons, such as significantly higher target utilization, longer uptime, and prevention/removal of target defects related to re-deposition.
We review the influence of magnet motion acceleration/deceleration, the influence of endpoint motion offset (stagger), and the influence of magnet - to - substrate velocity ratio, on target utilization and lead-to-trail edge film uniformity. Trade-offs between uniformity and target utilization were established and characterized.
The optimization method we use employs a combination of theoretical simulations and experimental measurements. Theoretical analysis utilizes ANSYS static magnetic field simulations, erosion profile calculations including motion integration effects, and ray tracing method for sputtering film thickness calculations (MATLAB). The structure and uniformity of LSMA-deposited thin films was characterized experimentally by XRF and SEM, and the target erosion measured by weight and erosion profiles of spent targets.
We have demonstrated that, with a judicious design approach, an optimal range of operating parameters can be defined and target utilizations above 70%can be reached, while maintaining deposition uniformity below 2% with excellent film properties. This makes the LSMA plasma source (using planar targets) more economically competitive than static and rotatable magnetrons.