AVS 62nd International Symposium & Exhibition
    Materials Characterization in the Semiconductor Industry Focus Topic Tuesday Sessions
       Session MC-TuM

Invited Paper MC-TuM1
Expanding Roles of Materials Characterization and Metrology in Advancing Moore's Law

Tuesday, October 20, 2015, 8:00 am, Room 114

Session: Characterization of 3D structures
Presenter: Ying Zhou, Intel Corporation
Authors: Z. Ma, Intel Corporation
Y. Zhou, Intel Corporation
Correspondent: Click to Email
Moore’s law scaling in the past decade was propelled by important technology breakthrough and innovation. Wide acceptance of popular low power devices such as smartphone and tablet continues to drive dimension scaling to achieve desired performance, power consumption and cost. However, traditional geometrical scaling for devices and interconnects encountered some fundamental material issues and scaling limits. To address these challenges, new classes of materials and device structures are being investigated for possible applications. The evaluation and introduction of disruptive process technologies and novel devices are driving strong interests in new material characterization techniques and methods. Process monitoring and control put stringent requirements on metrology capabilities at both technology development and manufacturing stages. This presentation will talk about the growing needs for materials characterization and metrology and their pivotal roles in enabling technology breakthrough and manufacturing sustaining. A comprehensive metrology approach is recommended to push ultimate analytical capabilities and accuracy while delivering required measurement consistency and data turns through automation and design for metrology.