| AVS 62nd International Symposium & Exhibition | |
| Helium Ion Microscopy Focus Topic | Thursday Sessions |
| Session HI+AS+SS+NS-ThM |
| Session: | Focused Ion Beam Technology (08:00-10:00)/Fundamentals of Helium Ion Microscopy (11:00-12:20) |
| Presenter: | Sven Bauerdick, Raith GmbH, Germany |
| Authors: | S. Bauerdick, Raith GmbH, Germany L. Bruchhaus, Raith GmbH, Germany J. Fridmann, Raith America, Inc. P. Mazarov, Raith GmbH, Germany A. Nadzeyka, Raith GmbH, Germany R. Jede, Raith GmbH, Germany |
| Correspondent: | Click to Email |
Focused ion beam (FIB) systems are applied to a wide range of applications in R&D nanofabrication, both for creating functional devices as well as for preparing sample imaging and analysis. With different ion species on one hand and very sophisticated patterning approaches on the other hand it is possible to improve results and provide solutions for more advanced applications. Here we show and discuss the capabilities of Ga and new ion species like Au or Si with high resolution, long-term stability and easy handling, which is combined with an instrument design enabling large area or elongated patterns by write field stitching or truly continuous writing, respectively.
The type of ion defines the nature of the interaction mechanism with the sample and has significant consequences on the resulting nanostructures or samples. Therefore, we have extended the FIB technology towards the delivery of multiple ion species selectable into a nanometer-scale focused ion beam by employing a liquid metal alloy ion source (LMAIS). A mass separation filter is incorporated into the column to allow for fast and easy switching between different ions. The respective capabilities of mainly Ga, Au and Si have been investigated (resolution, milling rate, imaging, implantation) and according results and applications will be presented.
Moreover we investigated, optimized and tested milling approaches for pattern (write field) stitching and for truly continuous patterning based on precise stage movement while milling/ cutting with the ion beam. An improved beam pattern needs to mimic the looping strategy of conventional milling, so that grooves with defined depth, steep sidewalls and minimum re-deposition can be achieved. This combination of functionality enables applications like nanofabrication of micro-fluidic mixers, zone plates, large area gratings, or wafer-level nanopore devices as well as sample investigation e.g. imaging, X‑sectioning and preparation in an automated way. Examples for new nanofabrication techniques like large area hard masking by implantation, both for reducing and increasing the rate in standard etching processes, or seamless direct milling of nano-fluidic channels over cm’s will be discussed.