| AVS 62nd International Symposium & Exhibition | |
| Helium Ion Microscopy Focus Topic | Thursday Sessions |
| Session HI+AS+SS+NS-ThM |
| Session: | Focused Ion Beam Technology (08:00-10:00)/Fundamentals of Helium Ion Microscopy (11:00-12:20) |
| Presenter: | Andre Linden, Raith America, Inc. |
| Authors: | A. Linden, Raith America, Inc. A. Rudzinski, Raith GmbH M. Levermann, Raith GmbH T. Michael, Raith GmbH E. Maynicke, RWTH Aachen |
| Correspondent: | Click to Email |
Nanopatterning processes and corresponding parameters are typically well understood for standard nanofabrication applications using resist based electron beam lithography (EBL) or FIB milling processes (e.g. for TEM lamella preparation).
Recently however, the bandwidth of nanofabrication applications for dedicated nanopatterning tools has significantly broadened and is no more limited to resist based EBL and mere, standard FIB milling tasks. Some latest generation multi-technique electron and ion beam nanolithography tools even facilitate additional in situ processes such as resistless focused electron or ion beam induced processes - e.g. material deposition or gas enhanced etching. The number of variable parameters for such complex processes involving e.g. new gas chemistry or ion species is nearly “infinite”. Moreover, smart and flexible patterning strategies, e.g. by using loops in conjunction with various multi-directional patterning modes, have significant impact on the final nanostructure´s definition and performance, so that a straight in situ characterization of e.g. material deposition, milling or etching rates becomes crucial for most efficient understanding and subsequent optimization of such processes.
In contrast to elaborately using additional analytical equipment outside the vacuum and subsequently re-introducing the sample for further processing and optimization, we have implemented a distance sensitive nanomanipulator with nanoprofilometric capabilities into our professional multi-technique nanofabrication tools, which allows in situ characterization of nanostructures in 3D with ~10nm resolution by collecting topographic sample surface information.
First results of direct in situ growth rate determination of focused electron beam induced material deposition (FEBID) for process calibration as well as 3D surface topographic information of challenging milling applications will be presented.