AVS 62nd International Symposium & Exhibition | |
Electronic Materials and Processing | Thursday Sessions |
Session EM-ThM |
Session: | Interconnects II |
Presenter: | Dongfei Pei, University of Wisconsin-Madison |
Authors: | D. Pei, University of Wisconsin-Madison M. Nichols, University of Wisconsin-Madison S.W. King, Intel Corporation J. Clarke, Intel Corporation Y. Nishi, Stanford University J.L. Shohet, University of Wisconsin-Madison |
Correspondent: | Click to Email |
This work was supported by the Semiconductor Research Corporation under Contract No. 2012-KJ-2359 and by the National Science Foundation under Grant CBET-1066231.
[i] M. T. Nichols, H. Sinha, C. A. Wiltbank, G. A. Antonelli,Y. Nishi, and J. L. Shohet, Appl. Phys. Lett 100, 112905 (2012)