AVS 62nd International Symposium & Exhibition
    Electronic Materials and Processing Thursday Sessions
       Session EM+MS-ThM

Paper EM+MS-ThM1
Hollow Cathode Plasma-Assisted Atomic Layer Deposition of Wurtzite InN and InxGa1-xN Thin Films with Low Impurity Content

Thursday, October 22, 2015, 8:00 am, Room 210E

Session: III-N Nitrides for Optoelectronic Applications
Presenter: Ali Haider, Bilkent University, Turkey
Authors: A. Haider, Bilkent University, Turkey
S. Kizir, Bilkent University, Turkey
C. Ozgit-Akgun, Bilkent University, Turkey
E. Goldenberg, Bilkent University, Turkey
M. Alevli, Bilkent University, Turkey
A. Kemal Okyay, Bilkent University, Turkey
N. Biyikli, Bilkent University, Turkey
Correspondent: Click to Email

Among the III-nitride compound semiconductor family, InN is known with its unique properties which are crucial for both electronic and optoelectronic applications such as narrow band gap, small effective mass, and high electron mobility. Since InN and its alloys are currently the backbone of LED industry for bandgap tuning and are mostly grown using high-temperature epitaxy, experimental efforts on enabling low-temperature growth are critical to widen its perspective for applications like flexible (opto)electronics. In addition, a growth method in which indium composition can be precisely controlled for InxGa1-xN alloys is highly imperative for band gap engineering.

In this work, we summarize our recent progress on the development of crystalline InN and InxGa1-xN thin films with low impurity content at a substrate temperature as low as 200 °C by hollow cathode plasma-assisted ALD (HCPA-ALD). Deposition of polycrystalline wurtzite InN thin films was achieved using trimethylindium (InMe3) and N2 plasma sources. Process parameters including InMe3 pulse time, N2 flow rate and duration, purge time, deposition temperature, and plasma power were investigated. Detailed structural and optical characterizations of InN and InxGa1-xN were performed. N2 plasma exposure time had a profound effect on the impurity content of the InN films. After saturating the surface of substrate with InMe3 molecules, the ligands of InMe3 were removed completely only after sufficient exposure dose of N2 plasma. Insufficient exposure times of N2 plasma resulted in InN films with higher carbon impurity contents as determined from XPS measurements, which were arising from methyl ligands of InMe3. After optimizing the precursor dosages,XPS survey scan obtained from the bulk part of the InN film showed that h-InN films were carbon and oxygen free. On the other hand, indium composition in different InxGa1-xN thin films was determined by energy-dispersive X-ray spectroscopy, X-ray photoelectron spectroscopy, and X- ray diffraction. GIXRD measurements revealed the hexagonal wurtzite crystalline structure of the grown InN and InxGa1-xN thin films. Refractive index of the InN film at 750 nm was estimated to be 2.67 while refractive indices of InxGa1-xN thin films increased from 2.28 to 2.42 at wavelength of 650 nm with increase in indium composition. Optical band edge studies of the InxGa1-xN films confirmed the successful tunability of the optical band-edge with alloy composition. Our results show that HCPA-ALD is an alternative technique to grow crystalline InN and InxGa1-xN films at low substrate temperatures.