| AVS 61st International Symposium & Exhibition | |
| Manufacturing Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| MS-ThP1 Development of Dispersed C60-Molecules/Al Composite Materials Using Nanocrystalline Al Powder Synthesized by Pulsed Wire Evaporation Method Daiki Muto, A. Matsumuro, Aichi Institute of Technology, Japan |
| MS-ThP2 Reliability Improvement in Metal Hard-mask based Cu/Ultra Low-K Interconnects by Damage Reduction MingDa Hsieh, United Microelectronics Corporation, Taiwan, Republic of China |
| MS-ThP4 Electrical Contact Resistance Characteristics of 28nm HK/MG Gate-Last Process with Advanced Manufacture Technology Ching-Pin Hsu, C.L. Lu, Y.C. Lin, F.Y. Chang, K.Y. Liao, C.L. Chen, United Microelectronics Corporation, Taiwan, Republic of China, L. Chen, C. Huang, C. Chen, Tokyo Electron Taiwan, Republic of China, J. Tsai, Y. Hsiao, A. Wang, Hermes Epitek, Taiwan, Republic of China |
| MS-ThP5 Double Patterning Critical Open of Dual Damascene Approach for 14nm Node Beyond ShihChun Tsai, United Microelectronics Corporation, Taiwan, Republic of China |
| MS-ThP6 Vertical Poly Dimethylsiloxane (PDMS) Fluidic Channel Fabrication by Rapid Prototyping Yu-Hsin Lin, P.L. Chen, NARL, Taiwan, Republic of China, Y.S. Lin, Hungkuang UniversityHungkuang University, Y.H. Tang, C.C. Yang, M.H. Shiao, C.N. Hsiao, NARL, Taiwan, Republic of China |
| MS-ThP7 Fabrication of Deeply Striped Pattern Structures by ICP-RIE Technique on the Lithium Niobate Substrate Chun-Ming Chang, M.-J. Huang, J.Y. Su, N.N. Chu, C.N. Hsiao, M.H. Shiao, ITRC, NARL Taiwan, Republic of China |
| MS-ThP9 Fabrication of Micro ring Resonators for Nonlinear Optics Applications using Silicon Nitride Film Deposited at Room Temperature Overcoming the Stress Limitation Adriano Ricardo do Nascimento Jr., L.T. Tiago Manera, J.A. Alexandre Diniz, A.R. R. Silva, M.V. Vinicius Puydinger dos Santos, University of Campinas, Brazil, A.C. Cerqueira S. Jr., National Institute of Telecommunications, Brazil, L.A. A. M. Barea, N.C. C. Frateschi, University of Campinas, Brazil |