| AVS 61st International Symposium & Exhibition | |
| Electronic Materials and Processing | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | EM-TuM1 Invited Paper Cu/ULK ULSI On-Chip Wiring Technologies, and Related Devices Daniel Edelstein, IBM |
| 8:40am | EM-TuM3 Selectivity Characterization and Enhancement of Metal-Organic Chemical Vapor Deposited (MOCVD) Selective Cobalt Cap for Advanced Back End of Line Jeff Shu, Z. Sun, Y.B. Lee, J. Palazzo, Z. Bayindir, M. Hossain, S. Choi, J. Rullan, H. Liu, GLOBALFOUNDRIES U.S. Inc. |
| 9:00am | EM-TuM4 Precise Control of the Residual Stress Levels in Polycrystalline Thin Films for Advanced Interconnects and N/MEMS Applications Hang Yu, C.V. Thompson, Massachusetts Institute of Technology |
| 9:20am | EM-TuM5 CVD Mn-based Barrier for Advanced Copper Interconnect Technology: Integration Study Nicolas Jourdan, IMEC, Belgium |
| 9:40am | EM-TuM6 Cryogenic Etching vs P4 Approaches: Paths towards Ultra-low Damage Integration of Mesoporous Oxide Dielectric Materials Jean-Francois de Marneffe, IMEC, Belgium, L. Zhang, M.H. Heyne, M. Krishtab, IMEC, KU Leuven, Belgium, A. Goodyear, M. Cooke, Oxford Instruments Plasma Technologies, N. Heylen, I. Ciofi, L.G. Wen, C.J. Wilson, IMEC, Belgium, V. Rutigliani, University Bari, Italy, S. Decoster, IMEC, Belgium, T. Savage, SBA Materials, Inc., K. Matsunaga, K. Nafus, Tokyo Electron Kyushu Limited, Japan, J. Boemmels, Z. Tokei, M. Baklanov, IMEC, Belgium |
| 11:00am | EM-TuM10 Invited Paper Reliability of Advanced Interconnects Carl V. Thompson, Massachusetts Institute of Technology |
| 11:40am | EM-TuM12 Metal Resistivity Below 10 nm Daniel Gall, P. Zheng, D. Guan, Rensselaer Polytechnic Institute, J.S. Chawla, Intel Corporation, T. Zhou, Rensselaer Polytechnic Institute |