AVS 61st International Symposium & Exhibition
    Surface Science Friday Sessions
       Session SS+EM-FrM

Paper SS+EM-FrM6
Mechanism Changes Caused by Metal Catalyst During Silicon Etching in V2O5 + HF Solutions

Friday, November 14, 2014, 10:00 am, Room 309

Session: Semiconductor Surfaces and Interfaces 2
Presenter: Kurt Kolasinski, West Chester University
Authors: K.W. Kolasinski, West Chester University
W.B. Barclay, West Chester University
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Etching of Si in oxidant + HF solutions can lead to a self-limiting reaction that spontaneously produces nanocrystalline porous Si – a process known as stain etching. The presence of a metal catalyzes and localizes etching such that ordered arrays of pores or nanowires can be formed depending on the structure of the metal – a process known as metal assisted etching (MAE). Ag, Au, Pd and Pt were deposited from solution onto H-terminated Si to act as catalysts for MAE. The metals all catalyzed the injection of holes into the Si. They all increased the rate of hole injection by approximately a factor of 5. The stoichiometry of MAE in V2O5 + HF solutions depended on the chemical identity of the metal. The stoichiometry when etching with Ag and Au was the same as for stain etching in V2O5 + HF solutions. However, for Pd and Pt, the stoichiometry differed significantly, consuming more V2O5 and producing less H2 per mole of Si etched. This indicates that the metal catalyst can change the mechanism of etching. Etching in V2O5 + HF solutions was well behaved and gave consistently reproducible kinetic results. The behavior is much different when HOOH is added instead of V2O5. In the absence of deposited metal, no reaction occurs with HOOH. When HOOH was added to metal-coated Si samples immersed in HF(aq), etching was immediate in all cases. In contrast to V2O5, we were unable to obtain well-behaved stoichiometric results for HOOH + HF solutions. This is related to heightened sensitivity on reaction conditions compared to the V2O5 system as well as nonlinearities introduced by side reactions.

The mechanism of Si etching changes based on the presence of a metal catalyst during metal assisted etching and depends on the chemical identity of the metal. A valence 2 path dominates the formation of photoluminescent nanoporous Si in stain etching as well as MAE with Ag and Au. A valence 4 path dominates the formation of photoluminescent nanoporous Si in MAE with Pt. However for MAE with Pd, no nanoporous Si is formed initially and a mixture of valence 4 and valence 2 processes is observed. The nature of the electron transfer process and its dependence on the electronic structure of the metal/Si interface will be discussed.