AVS 61st International Symposium & Exhibition
    Plasma Science and Technology Thursday Sessions
       Session PS1+TF-ThM

Paper PS1+TF-ThM11
Plasma Assisted Atomic Layer Epitaxy of III-N Ternaries for Next Generation Devices

Thursday, November 13, 2014, 11:20 am, Room 305

Session: Plasma Deposition and Plasma Assisted ALD
Presenter: Neeraj Nepal, Naval Research Laboratory
Authors: N. Nepal, Naval Research Laboratory
J.K. Hite, Naval Research Laboratory
V.R. Anderson, Naval Research Laboratory
V.D. Wheeler, Naval Research Laboratory
S. Qadri, Naval Research Laboratory
C.R. Eddy, Naval Research Laboratory
Correspondent: Click to Email

III-Ns (InN GaN and AlN) and their alloys have been attractive semiconductor materials for application in a wide range of device technologies. The most common growth methods of this material system are CVD and MBE, but these conventional growth techniques have challenges in achieving alloys without phase separation over the entire stoichiometric range, ultimate thickness control at the atomic level, and the ability for in situ growth of complete device structures. Plasma-assisted atomic layer epitaxy (PA-ALE) is a promising method to grow III-N alloys and incorporate them into device structures as it allows low temperature growth and precise control of thickness, stoichiometry and uniformity. Recently, PA-ALE has been used for the growth of III-N binaries at low temperatures (≤500°C)[1,2]. Ternary growth at these low temperatures could eliminate miscibility gaps, which has been an issue for conventional growth methods.

We present the growth and characterization of III-nitride ternaries by PA-ALE over a wide stoichiometric range including the range where phase separation has been an issue for MBE and CVD. Using our previously reported optimal growth conditions for GaN, InN [1], and AlN [2], AlxGa1-xN, InxAl1-xN and InxGa1-xN (0≤x≤1) alloys were grown at 250–500 °C. Group III-B metal contents in these alloys were varied with binary cycle ratios and the alloy compositions were determined by XPS and XRD and reflectivity measurements. Since the growth rate (GR) of InN is slower than that of AlN, a digital alloy produced from 3 cycles of InN for every cycle of AlN results in an Al0.83In0.17N film. The GaN GR, however, is slower than InN, and In0.54Ga0.46N alloy was grown for every alternating cycle of GaN and InN. Additionally, 4 cycles of GaN for every cycle of AlN gave Al0.5Ga0.5N alloy and the measured concentration was confirmed optically. By this digital alloy growth method, we are able to grow In containing ternaries by PA-ALE in the spinodal decomposition region (15-85%). The surface roughness of III-N alloys on GaN were the same as the starting roughness of 0.4 nm. Optimal ternary growth conditions were used to synthesize III-N based device structures on GaN and demonstrated 2DEG at the interface. We will present electrical and optical data on ALE III-N heterojunctions on GaN templates.

These early efforts suggest great promise of PA-ALE for addressing miscibility gaps issue encountered with conventional growth methods and realizing high performance optoelectronic and electronics devices involving ternary/binary heterojunctions, which are not currently possible.

[1] N. Nepal et al., JCGS 13,1485 (2013).

[2] N. Nepal et al., APL 103, 082110 (2013).