AVS 61st International Symposium & Exhibition
    Materials Characterization in the Semiconductor Industry Focus Topic Tuesday Sessions
       Session MC-TuP

Paper MC-TuP6
Some Experience in Characterizing Thin Films on Next Generation 450mm Wafer with Spectroscopic Ellipsometry

Tuesday, November 11, 2014, 6:30 pm, Room Hall D

Session: Poster Session for all areas of Materials Characterization in the Semiconductor Industry
Presenter: Richard Sun, Angstrom Sun Technologies Inc.
Authors: R. Sun, Angstrom Sun Technologies Inc.
N. Sun, Angstrom Sun Technologies Inc.
Correspondent: Click to Email

Under guidance of International SEMATECH Manufacturing Initiative(ISMI), Angstrom Sun Technologies Inc developed the first tabletop spectroscopic ellipsometer for 450mm wafer application. A few challenges regarding wafer handling and small edge exclusion requirement will be discussed. With improved modeling, spectroscopic ellipsometry could also be used to determine EBR profile of photoresist by linear line scan near the wafer edge.