| AVS 60th International Symposium and Exhibition | |
| Electronic Materials and Processing | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | EM+AS+PS+TF-ThM1 Measurement of the Bandgap Energies in Low-k Organosilicates M. Nichols, University of Wisconsin-Madison, Q. Lin, IBM T.J. Watson Research Center, S. Banna, Applied Materials Inc., Y. Nishi, Stanford University, J.L. Shohet, University of Wisconsin-Madison |
| 8:20am | EM+AS+PS+TF-ThM2 Complementary Porosity Metrologies for Porous Ultra Low-k Material D. Yang, R. Opila, University of Delaware, V. Pallem, Air Liquide, D. Dutta, D. Gidley, University of Michigan, N. Bhargava, University of Delaware |
| 8:40am | EM+AS+PS+TF-ThM3 Invited Paper Future of Ultra Low-k Materials W. Volksen, T. Magbitang, K. Lionti, G. Dubois, IBM Almaden Research Center |
| 9:20am | EM+AS+PS+TF-ThM5 Porosity Scaling Strategies for Low-k Films D.J. Michalak, J.M. Blackwell, A. Sengupta, J.S. Clarke, D. Pantuso, Intel Corporation |
| 9:40am | EM+AS+PS+TF-ThM6 Ellipsometric Porosimetry Surface Characterization of Oxygen Plasma Damage and κ Repair on Ultra Low κ Dielectrics Z. Sun, GLOBALFOUNDRIES U.S. Inc., A. Bondaz, T. Karpowicz, Semilab, V. Seshachalam, S. Srivathanakul, H. Liu, GLOBALFOUNDRIES U.S. Inc. |
| 10:40am | EM+AS+PS+TF-ThM9 Pore Stuffing to Enable Interconnect Scaling J.D. Bielefeld, M. Chandhok, J.S. Clarke, C.J. Jezewski, K. Singh, A.M. Myers, J.M. Torres, R. Turkot, Intel Corporation |
| 11:00am | EM+AS+PS+TF-ThM10 Invited Paper Molecular Layer Deposition of Organic Films for Nanoelectronics Applications S.F. Bent, Stanford University |
| 11:40am | EM+AS+PS+TF-ThM12 Surface Photoconductivity of Low-k Organosilicates Induced by Plasma Vacuum Ultraviolet Radiation H. Zheng, D. Pei, M. Nichols, University of Wisconsin-Madison, S. Banna, Applied Materials Inc., Y. Nishi, Stanford University, J.L. Shohet, University of Wisconsin-Madison |