AVS 60th International Symposium and Exhibition | |
Plasma Science and Technology | Tuesday Sessions |
Session PS-TuP |
Session: | Plasma Science and Technology Poster Session |
Presenter: | P.K. Kao, National Taiwan University, Taiwan, Republic of China |
Authors: | P.K. Kao, National Taiwan University, Taiwan, Republic of China P.J. Kuo, Tokyo Electron Taiwan Limited, Taiwan, Republic of China P.W. Chiou, Tokyo Electron Taiwan Limited, Taiwan, Republic of China C.C. Chou, Tokyo Electron Taiwan Limited, Taiwan, Republic of China C.C. Hsu, National Taiwan University, Taiwan, Republic of China |
Correspondent: | Click to Email |
Fluorocarbon films deposited using c-C4F8/N2/Ar capacitively coupled plasmas are studied with the goal of understanding the effects of N2-addition on surface chemistry. The plasma system used is a parallel-plate discharge sustained by a 13.56 MHz power source with the electrode diameter 25.4 cm and a gap distance 6 cm . Quartz crystal microbalance (QCM), Fourier transform infrared spectroscopy (FTIR), x-ray photoelectron spectroscopy (XPS), and contact angle measurement are used to characterize the film properties. QCM measurements show a monotonically increase in the deposition rate with N2 addition, suggesting that CNxFy deposition rate surpassed the rate of forming volatile species. FTIR spectra show an additional adsorption near 1350 cm-1 for conditions with N2 addition. This can be caused by either the incorporation of nitrogen into the polymer chain or by creation of additional disordered sp2 carbon in the film. The XPS C1s spectrum of the film shows four major peaks, assigned to CFx (x= 1, 2, 3) and C-CFbonds. With N2 admixture, CFN bonds appear in the C1s spectrum, while the amount of CF3 and CF2 bonds only decrease slightly. In support of the XPS data, the water contact angle on FC films remains 100~110°and does not change noticeably with N2-addition. At the end of the presentation, the process significance in N2 addition into c-C4F8/Ar/N2 plasmas will be discussed.