| AVS 58th Annual International Symposium and Exhibition | |
| Thin Film Division | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | TF1-ThM1 Protrusions, Surface Grains and Extended Single-Crystalline Plates Alejandro González González, Instituto de Ciencia de Materiales de Madrid, Consejo Superior de Investigaciones Científicas, Spain, G.M. Alonzo Medina, A.I. Oliva, Centro de Investigaciones y de Estudios Avanzados del IPN, CINVESTAV Unidad de Mérida, Mexico, C. Polop, Universidad Autónoma de Madrid, Facultad de Ciencias, Spain, E. Rodríguez Cañas, J.L. Sacedón, E. Vasco, Instituto de Ciencia de Materiales de Madrid, Consejo Superior de Investigaciones Científicas, Spain |
| 8:20am | TF1-ThM2 Characterization of Mg Acceptors in GaN:Mg Grown by Metal Modulated Epitaxy and MOCVD Jonathan Lowder, M.W. Moseley, B. Gunning, W.A. Doolittle, Georgia Institute of Technology, M.E. Zvanut, J. Dashdorj, University of Alabama |
| 8:40am | TF1-ThM3 Invited Paper Post Deposition Annealing Effects on Thin Film Material, Process, and Device Properties Yue Kuo, Texas A&M University |
| 9:20am | TF1-ThM5 Semiconductor Thin Film Metrology using Coherent Acoustic Phonon Spectroscopy Andrew Steigerwald, K. Varga, A.B. Hmelo, Vanderbilt University, L. Feldman, Rutgers University, N.H. Tolk, Vanderbilt University |
| 9:40am | TF1-ThM6 On the Phase Formation of Reactively Sputtered ZrO2 Thin Films Rony Snyders, G. Geumez, S. Konstantinidis, UMons, Belgium |
| 10:40am | TF1-ThM9 Effect of 10 keV X-rays on Silicon Oxidation Shweta Bhandaru, S.M. Weiss, E.X. Zhang, D.M. Fleetwood, R.A. Reed, R.A. Weller, B.R. Rogers, R.R. Harl, Vanderbilt University |
| 11:00am | TF1-ThM10 Investigating the Local Physical Structure of Amorphous Hydrogenated Boron Carbide Michelle Paquette, W. Li, M.S. Driver, S. Karki, N.A. Oyler, A.N. Caruso, University of Missouri - Kansas City |
| 11:20am | TF1-ThM11 Characterization of Amorphous and Nanocomposite Nb-Si-C Thin Films Deposited by dc-Magnetron Sputtering Nils Nedfors, Uppsala University, Sweden, O. Tengstrand, Linköping University, Sweden, A. Flink, Impact Coatings AB, Sweden, A.M. Andersson, ABB AB, Corporate Research, Sweden, P. Eklund, L. Hultman, Linköping University, Sweden, U. Jansson, Uppsala University, Sweden |
| 11:40am | TF1-ThM12 Evaluation of Mn-based Cu Barriers for Interconnect Applications Els Van Besien, N. Jourdan, IMEC, Belgium, L. Zhao, Intel assignee at IMEC, Belgium, K. Croes, Y.K. Siew, S. Van Elshocht, Zs. Tőkei, IMEC, Belgium |