AVS 58th Annual International Symposium and Exhibition
    Thin Film Division Wednesday Sessions
       Session TF1+EM-WeA

Paper TF1+EM-WeA2
PE-MOCVD of GeTe Materials for Phase Change Memory Applications

Wednesday, November 2, 2011, 2:20 pm, Room 109

Session: Nonvolatile Memory
Presenter: Emilie Despiau-Pujo, LTM/CNRS-UJF, France
Authors: E. Despiau-Pujo, LTM/CNRS-UJF, France
L. Dussault, LTM/CNRS-UJF, France
C. Vallée, LTM/CNRS-UJF, France
E. Gourvest, ST Microelectronics, France
D. Jourde, CEA Leti Minatec Campus, France
S. Maitrejean, CEA Leti Minatec Campus, France
P. Michallon, CEA Leti Minatec Campus, France
Correspondent: Click to Email

Phase-Change Random Access Memories (PCRAM) are very promising candidates for next generation of non-volatile memories. Those devices store information using the high electrical contrast between the amorphous and crystalline phases of chalcogenide alloys such as Ge2Sb2Te5 (also called GST) which are mainly deposited by physical vapor deposition (PVD) [1]. However, two important drawbacks have to be overcome: a too short archival life for GST at high operating temperatures and a too high power consumption. The binary compound GeTe seems to be a promising candidate for high temperature applications since it has an estimated archival life up to ten years at 110°C. A pronounced increase in thermal stability of N- and C-doped GeTe was also demonstrated [2].

Concerning the power consumption, it was shown that a way to reduce the high operating currents is to confine the material. In this way, several groups try to develop a new deposition process to achieve the gap filling of the confined structure. Atomic Layer Deposition (ALD) of GST has shown very good step coverage but the deposition rate remains very low. Therefore, we proposed to study the deposition of GeTe in a shower-head type 200mm plasma-enhanced pulsed liquid injection CVD reactor (AltaCVD200). Ge and Te liquid precursors are introduced into the deposition chamber as vapours through a pulsed injection system and an evaporating furnace. A capacitively-coupled RF plasma is applied between the shower head and the substrate heater to decompose the precursors. Chamber walls are maintained at 70°C to avoid condensation of precursors vapours. The deposition chamber is mounted on a cluster tool which allows quasi in situ analysis of the deposited films by angle-resolved XPS while the plasma is analyzed by optical emission spectroscopy (OES).

In this paper, we investigate the optical emission spectra of high pressure (2-20 Torr) Ge- and Te-containing plasmas. Reference UV-visible emission spectra (200-800 nm) are recorded for various conditions of RF power, pressure, and flow rate. The role of electrons and H atoms in the decomposition of Ge and Te precursors is discussed by correlating the OES of the plasma with the chemico-physical properties of the deposited material. It is shown that H atoms induce a competitive effect between deposition (due to the decomposition of the precursors) and etching of Ge and Te atoms at the growing film surface. Role of C contamination in the phase change properties is also discussed and phase transitions of plasma deposited GeTe-C materials are compared with sputtered GeTe-C.

[1] G. W. Burr et al, J. Vac. Soc. Technol. B 2010, 28 (223)

[2] A. Fantini et al, IEDM 2010