AVS 56th International Symposium & Exhibition
    Plasma Science and Technology Wednesday Sessions

Session PS2+TF-WeM
Plasma Deposition and Plasma-assisted ALD

Wednesday, November 11, 2009, 8:00 am, Room B2
Moderator: E.R. Fisher, Colorado State University


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am PS2+TF-WeM1
Plasma Polymerization of bis-1, 2-(triethoxysilyl) Ethane (BTSE): Interfacial Characterization by ToF-SIMS and XPS
A. Batan, Univ. Libre de Bruxelles, Facultés Univ. Notre-Dame de la Paix, Belgium, N. Mine, B. Douhard, Facultés Univ. Notre-Dame de la Paix, Belgium, F. Brusciotti, I. De Graeve, J. Vereecken, Vrije Univ. Brussel, Belgium, M. Wenkin, M. Piens, Coating Research Inst., Belgium, H. Terryn, Vrije Univ. Brussel, Belgium, J.J. Pireaux, Facultés Univ. Notre-Dame de la Paix, Belgium, F. Reniers, Univ. Libre de Bruxelles, Belgium
8:20am PS2+TF-WeM2
Self-limiting Deposition of Nanolaminates by Pulsed PECVD
P.C. Rowlette, C.A. Wolden, Colorado School of Mines
8:40am PS2+TF-WeM3 Invited Paper
Tailoring PECVD Ultra-Low-k Films for Nanoscale Interconnects
E.T. Ryan, GLOBALFOUNDRIES, S.M. Gates, S. Cohen, Y. Ostrovski, V. Patel, E. Simonyi, C. Dimitrakopoulos, IBM T.J. Watson Research Center, A. Madan, IBM Microelectronics, G. Dubois, IBM Almaden Research Center, A. Grill, IBM T.J. Watson Research Center
9:20am PS2+TF-WeM5
Amplitude Modulated Pulse RF Discharges for Producing and Driving Nano-Blocks
S. Iwashita, H. Miyata, H. Matsuzaki, K. Koga, M. Shiratani, Kyushu University, Japan
9:40am PS2+TF-WeM6
Plasma Deposition of Platinum-Based Nanocomposite Films as Fuel Cell Electrocatalysts
A. Milella, E. Dilonardo, University of Bari, Italy, F. Palumbo, Institute for Inorganic Methodologies and Plasmas (IMIP)- CNR, Italy, S. Martin, CEA-G/ Leti, France, R. d'Agostino, F. Fracassi, University of Bari, Italy
10:40am PS2+TF-WeM9
Contribution of CN Radicals to the Nitrogen Content of Plasma-Deposited a-CNx Materials
J.M. Stillahn, E.R. Fisher, Colorado State University
11:00am PS2+TF-WeM10
Comparison between a DC Reactive Magnetron Sputtering Discharge in an Ar/NH3 and Ar/H2/N2 Gas Mixture
F. Henry, A. Batan, F. Reniers, Université Libre de Bruxelles, Belgium
11:20am PS2+TF-WeM11
The Application of AC Diode Sputtering for Aluminum Thin Films in Small Apertures
D.R. Walters, Argonne National Laboratory
11:40am PS2+TF-WeM12
3D Plasma Simulations of a High Density Plasma CVD Reactor using VIZGLOW
P. Kothnur, R. Kinder, Novellus Systems, Inc., X. Yuan, Esgee Technologies, Inc., L. Raja, The University of Texas at Austin