AVS 56th International Symposium & Exhibition
    Plasma Science and Technology Wednesday Sessions
       Session PS2+TF-WeM

Paper PS2+TF-WeM11
The Application of AC Diode Sputtering for Aluminum Thin Films in Small Apertures

Wednesday, November 11, 2009, 11:20 am, Room B2

Session: Plasma Deposition and Plasma-assisted ALD
Presenter: D.R. Walters, Argonne National Laboratory
Correspondent: Click to Email

A thin conductive film was applied on the inner surface of a small-aperture vessel using the AC Diode Sputtering process. This paper describes the process and the technical equipment used in this thin-film method. The process configuration presented here employs a dual-electrode arrangement, which creates a glow discharge field around both electrodes, thereby spreading out the affected area. An example of coating performed in a 5 mm by 12.5 mm rectangular channel by 3.4 m in length is present along with examples of circular cross-sectional channels. A significant challenge of this configuration is how to get a homogeneous pressure throughout a long constricted channel; results show that the dual inlet-output gas flow circuit was able to achieve the constancy needed for a satisfactory film. Analyses of the sample films confirm acceptable uniformity even in the pressure region of 600 mTorr. Further work has shown that the glow discharge can be maintained into a pressure regime of greater than 10 Torr.