AVS 56th International Symposium & Exhibition
    Plasma Science and Technology Monday Sessions
       Session PS2+PV-MoM

Paper PS2+PV-MoM4
Novel Model-Based Sensor for Thin Film Deposition on Large Area Substrates

Monday, November 9, 2009, 9:20 am, Room A8

Session: Plasma Processing for Photovoltaics
Presenter: L. Eichhorn, Plasmetrex
Authors: M. Klick, Plasmetrex, Germany
L. Eichhorn, Plasmetrex
R. Rothe, Plasmetrex
Correspondent: Click to Email

Large area plasma coating becomes more important with increasing diameter of semiconductor wafers and thin film Si solar cells. The layer characteristics as uniformity of films produced by capacitive RF plasmas depends on effects as the standing wave and skin effect.

A reduced plasma physical model in the novel sensor is used to describe special features of large area and capacitive RF plasmas. It involved dynamic electron effects by a fluid model for the plasma bulk and nonlinear mechanisms by a nonlinear sheath model - called it Nonlinear Extended Electron Dynamics (NEED).

It involves also the nonuniformity and nonlinearity of the plasma sheath in the front of the substrate electrode, large electrode area, and medium pressure. The model provides also the dependence of the Fourier spectrum of the local RF current on the plasma density and the electron collision rate. Only lower harmonics of the RF current can be observed at medium pressure (100 Pa – 1000 Pa). Depending on the amount of harmonics of the local RF current used, it can be utilized also to estimate important plasma parameters as the electron collision rate and the ratio of the excitation frequency to the resonance frequencies of the spatial modes is found to determine the nonuniformity caused by the standing wave. The skin depth can be estimated as well to show the influence on spatial distribution of the RF current.

The major advantage is the real time, robust, and non-intrusive characterization of large area plasmas. An additional feature is the easy calculation of the plasma sheath voltage distribution at the grounded counter electrode. Both is mandatory to understand and to control the deposition rate distribution in particular for large area RF plasmas. So cost-efficient virtual metrology can substitute partially the expensive and time intensive real metrology.