AVS 56th International Symposium & Exhibition
    Plasma Science and Technology Monday Sessions
       Session PS+MS-MoA

Invited Paper PS+MS-MoA3
22nm Technology Manufacturing Challenges - Window for Process Control becomes Smaller and Smaller, Equipment and Material Interaction Becomes Unpredictable and Manufacturing Costs Increase

Monday, November 9, 2009, 2:40 pm, Room A1

Session: Plasma Challenges at the 22nm Node and Beyond
Presenter: P. Adam, GLOBALFOUNDRIES Dresden, Germany
Correspondent: Click to Email
Increasing complexity and smaller and smaller CD for 22 nm technologies will have also a major impact for all plasma supported processes. The limited understanding of plasma and device interaction in existing technologies will further challenge the equipment suppliers to develop solutions for high volume manufacturing fabs. Some examples will be shown to illustrate this statement. Fab Engineers will see unexpected behaviour of materials in process chambers and surprising results of their plasma process on the device itself. A big amount of this will not be seen in the application labs of the equipment suppliers. Part of the problem is availability of appropriate test wafer material which can reflect the final manufacturing situation sufficient enough. Designs from different companies will behave most likely also differently. Therefore equipment suppliers have to move their development process close into the manufacturing site of the fabs. On the other side, semiconductor fab would like to get a tool and a process ready to go. They don’t have the time and the manpower to support this kind of development work for the equipment supplier. All this will drive additional cost for both supplier and costumer.

How we can overcome this situation? Some ideas will be presented highlighting the complexity of the situation and the need for close interaction of all involved parties.