|AVS 55th International Symposium & Exhibition|
|Plasma Science and Technology||Wednesday Sessions|
Click a paper to see the details. Presenters are shown in bold type.
Novel On-Wafer RF-Current Sensor: Sheath Impedance and Plasma Density
M.J. Titus, D.B. Graves, University of California, Berkeley
In-situ Diagnostic to Measure Charging During Plasma Etching
E. Ritz, M.J. Neumann, J.A. Hoban, D.N. Ruzic, University of Illinois at Urbana-Champaign
Time Dependence of Charge-Build-up Voltages in Production Etcher by On-Wafer Real Time Monitoring System
J. Hashimoto, T. Tatsumi, S. Kawada, N. Kuriyama, Miyagi Oki Electric Co., Ltd., Japan, I. Kurachi, Oki Electric Industry Co., Ltd., Japan, S. Samukawa, Tohoku University, Japan
Origin of Electrical Endpoint Signals in Rf-biased, Inductively Coupled Plasma Etching
M.A. Sobolewski, D.L. Lahr, National Institute of Standards and Technology
Local and Non-Local Changes of Plasma Parameters in an Expanding Thermal Plasma Reactor Coupled with a Pulse-Shape Substrate Biasing Technique
P. Kudlacek, R.F. Rumphorst, M. Creatore, M.C.M. van de Sanden, Eindhoven University of Technology, The Netherlands
Plasma Diagnostics by a Coaxial Resonant Cavity
S. Kobayashi, Applied Materials Inc.
On Detection and Prevention of Plasma Instabilities
V.L. Brouk, D.C. Carter, R.L. Heckman, Advanced Energy Industries, Inc.
Secondary RF Plasma Assisted Closed-Field Dual Magnetron Sputtering System for ITO Thin Film Deposition on Plastic Surfaces
L. Meng, R. Raju, University of Illinois at Urbana-Champaign, T. Dockstader, Kurt J Lesker Company, H. Shin, D.N. Ruzic, University of Illinois at Urbana-Champaign
Optical and Electrical Diagnostics of an Arc Plasma Jet under Atmospheric Pressure
C.Y. Wu, National Taiwan University, C.W. Chen, W.C. Cheng, Industrial Technology Research Institute, Taiwan, C.C. Hsu, National Taiwan University