| AVS 55th International Symposium & Exhibition | |
| Thin Film | Thursday Sessions |
| Session TF-ThP |
| Session: | Aspects of Thin Films |
| Presenter: | L. Zhang, DuPont |
| Authors: | L. Zhang, DuPont K. Lloyd, DuPont G. Blackman, DuPont L. Bao, DuPont J. Thompson, DuPont M. Plummer, DuPont D. Brill, DuPont J. Ryley, DuPont D. Reardon, DuPont |
| Correspondent: | Click to Email |
Surface and interface properties of thin films play an important role in a variety of existing and emerging industrial applications, including the development of semiconductor devices, surface coatings, heterogeneous catalysts, polymers, biological materials, and medical devices. Among these applications, the surfaces and interfaces of these materials often control device or part performance, therefore quantitative chemical and structural characterization in the near surface region are critical to quality. This presentation will cover two topics. The first part will focus on the applications of applying integrated methods/techniques to characterize surface roughness, film quality and thickness of ultrathin copper films prepared by the Atomic Layer Deposition (ALD) process. The second part of the presentation will discuss the surface and interface characterization of dielectric films prepared by the Physical Vapor Deposition (PVD) method.