|AVS 55th International Symposium & Exhibition|
|Thin Film||Thursday Sessions|
|Session:||Thin Films for Displays and Flexible Electronics|
|Presenter:||H. Chandra, General Plasma|
|Authors:||M.A. George, General Plasma
J.E. Madocks, General Plasma
J. Morris, General Plasma
H. Chandra, General Plasma
|Correspondent:||Click to Email|
In this paper we discuss the latest results of our development of large area PECVD source technologies for flexible substrates. A significant challenge for flexible displays is the economical application of thin films for use as vapor barriers, transparent conductive oxides, optical interference thin films and thin film silicon. Here at General Plasma we have developed two innovative PECVD source technologies that provide an economical alternative to low temperature sputtering technologies and enable some thin film materials not accessible by sputtering. The Penning Discharge Plasma (PDP™) source is designed for high rate PECVD depositions on insulating temperature sensitive web.1 This technology has been utilized to deposit SiO2 and SiC:H for barrier applications.2 The Plasma Beam Source (PBS™) is useful for deposition on conductive or rigid substrates or for deposition of thin films that are sensitive to the high ion bombardment flux inherent to the PDP technology. We have developed thin film processes in our laboratory for deposition of SiO2, SiC:O, SiN:C, SiN:H and thin film silicon via this PBS source.3 We discuss the patented source design, plasma physics and chemistry of the deposited thin films.
1 J.Madocks; “High Rate PECVD Source for Flexible Substrates”, Proceedings of the Society of Vacuum Coaters, pp 187, 2003.
2 V. Shamamian, L. Zambov, U. Pernisz, S. Kim, S. Perz and G. Cerny, “Progress in the Development of SiC:H Alloy Film on Flexible Substrates for Extremely Low Moisture Permeability Applications”, Proceeding of the Flexible Displays and Manufacturing Conference, 2006.
3 M.A. George, P. Morse, J. Morris, H. Chandra and J. Madocks, “Deposition of Silicon Oxide, Silicon Nitride and Silicon Carbide Thin Films by New Plasma Enhanced Chemical Vapor Deposition Source Technology”, Conference Proceedings of the Assoication of Industrial Metallizers, Coaters and Laminators (AIMCAL), 2007.