|AVS 55th International Symposium & Exhibition|
|Plasma Science and Technology||Thursday Sessions|
|Session:||Atmospheric Plasma Processing and Micro Plasmas|
|Presenter:||S.I. Jun, PSM America Inc.|
|Authors:||K.H. Lee, PSM America Inc.
H.R. Lee, PSM America Inc.
Y.J. Park, PSM America Inc.
S.I. Jun, PSM America Inc.
|Correspondent:||Click to Email|
We have characterized the parametric and functional properties of Atmospheric Pressure (AP) Plasma System with newly designed Arc-free and Antistatic Plate to provide uniform and arc-free AP plasma on substrates such as glass, wafers, and any flexible substrates for improving surface treatments. The AP Plasma System showed very highly efficient capabilities of removing organic contaminants for flat panel displays, semiconductor, and solar cell processing with very high throughputs and very low running coat provided by in-line layouts and usage of CDA (cold dry air) not using expensive gas such as helium. The AP treated substrates and thin films showed drastic lowering of the contact angles; 43 degree to 5 degree for bare glass substrate and 70 degree to 8 degree for ITO thin films. The etch rate non-uniformity of ITO films on 730x920mm glass substrate was improved from 8.8% to 7.5% after AP Plasma treatment with the Arc-free and Antistatic Plate. Besides these conventional applications of AP Plasma, we have proposed newly emerging applications, nanobiotechnologies. The AP Plasma System showed much improved performances in (1) direct contact with living tissue, (2) wound treatment with living tissue sterilization, (3) promoting blood coagulation, (4) skin flora sterilization, and (5) treatment of human melanoma, macrophages, and leishmania major promastigote cell line.