AVS 55th International Symposium & Exhibition
    MEMS and NEMS Tuesday Sessions
       Session MN-TuP

Paper MN-TuP3
Test Instrument for the Tensile Fracture Strength of Micro-Nano Materials

Tuesday, October 21, 2008, 6:30 pm, Room Hall D

Session: MEMS and NEMS Poster Session
Presenter: A. Kasahara, NRIM, Japan
Authors: A. Kasahara, NRIM, Japan
H. Suzuki, NRIM, Japan
M. Goto, NRIM, Japan
H. Araki, NRIM, Japan
Y. Pihosh, NRIM, Japan
M. Tosa, NRIM, Japan
Correspondent: Click to Email

Recent nano-technology researches have created various advanced micro-nano materials. In particular, there have been many reports on nano-meter-scale tubes and wires such as carbon nanotubes and silicon wires. We have prepared long crystal silicon wires with a diameter of several tens of nano meters at a temperature lower than 523k by using the low-pressure low-temperature CVD method. To use these as materials for application to micro-nano electromechanical system, we need to fully understand their electric, chemical and mechanical properties. As for the electric properties, current-voltage characteristics have been measured with the multi probe system using STM measurement units, although but there is almost few technique established for the measurement of mechanical properties. We have been therefore developing a strength measurement equipment for micro-nano materials to determine the mechanical properties of micro-nano wires in a vacuum for SEM observation. We will report this result on the development of test instrument to measure the tensile strength that can be observed with a desk-top simple SEM.