AVS 55th International Symposium & Exhibition | |
MEMS and NEMS | Monday Sessions |
Session MN-MoM |
Session: | Integrative Materials and Processes for MEMS/NEMS |
Presenter: | S. Kotru, The University of Alabama |
Authors: | J. Zhong, The University of Alabama S. Kotru, The University of Alabama H. Han, The University of Alabama R.K. Pandey, The University of Alabama |
Correspondent: | Click to Email |
Lead zirconate titanate (PZT)-based thin films are gaining increased interest in wide variety of applications in MEMS due to their large longitudinal and transverse piezoelectric coefficients, and the compatibility with microelectronic circuits. Both micro-machined sensors (such as accelerometer and gyroscope) and actuators (such as micro-motors, micro-pumps, and micro-switches) have been fabricated based on PZT films. The piezoelectric response of PZT films is the key factor for sensing and actuation function of a device; the higher the value, the better the device will act as sensor and/or actuator. Texture of the films plays a major role in determining the piezoelectric response. So far, the highest transverse piezoelectric coefficient (-12.0 C/m2) has been reported for {100}-textured PZT films grown on PbTiO3 seed layers. These PbTiO3 were sputtered at 500~600° C. High temperature sputtering limits the practical implementation of such films in MEMS devices due to process constraint and sample size limitations. In this work, highly {100}-textured PZT films have been grown with PbTiO3 seed layers. However, the seed layers in our work were deposited by chemical solution deposition. The effect of both Pb content and solution concentration of PbTiO3 on PZT films was investigated extensively. These PZT films show 97% of {100} texture and effective transverse piezoelectric coefficients of -13.3 C/m 2. Thus our films have higher effective transverse piezoelectric coefficient than the PZT films grown with sputtered PbTiO 3 seed layers. Our approach of obtaining {100}-textured PZT films with high piezoelectric response on chemically deposited seed layers has advantage of being much easy and low-cost. Such films are feasible for MEMS based device implementation.