AVS 55th International Symposium & Exhibition
    Applied Surface Science Tuesday Sessions
       Session AS-TuP

Paper AS-TuP22
Root-Cause Failure Analysis of Anneal-Chamber Reflector Plates using Advanced XPS and TEM/EDX Applications

Tuesday, October 21, 2008, 6:30 pm, Room Hall D

Session: Aspects of Surface Analysis Poster Session
Presenter: C. Lazik, Applied Materials, Inc.
Authors: C. Lazik, Applied Materials, Inc.
M. Jin, Applied Materials, Inc.
Y. Uritsky, Applied Materials, Inc.
L. Terry, Applied Materials, Inc.
Correspondent: Click to Email

Delamination failures were observed on reflector plates in Vantage RTP systems during start-up in late-2006. Root-cause analysis was required to complete the current tool sign-off and to identify suspect parts/spares in the field. The reflector plate supplier revealed they had upgraded their e-beam evaporation chamber in June, 2006, but that the coating characteristics, reflectivity and adhesion strength, had not changed. The product support team provided reflector plates manufactured before and after the e-beam evaporation chamber upgrade to the Defect and Thin-Film Characterization Laboratory (DTCL) to identify any differences in the coatings that may explain the failure. Using X-ray Photoelectron Spectroscopy (XPS) and Transmission Electron Spectroscopy (TEM), DTCL identified titanium poisoning within a ~30A oxide layer at the base of the adhesion film on all of the failed parts. Results enabled the product support team to pinpoint the failure mechanism, locate the contamination source in the supplier’s hardware, and implement new quality control inspection tests/procedures for new, incoming reflector plates.