| AVS 54th International Symposium | |
| Plasma Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | PS2-ThM1 Ion Flux Measurements in an Ar/NH3/SiH4 - Remote Plasma using a Pulse Shaped Double-Side Capacitive Probe M.C. Petcu, A.C. Bronneberg, M.A. Creatore, M.C.M. van de Sanden, Eindhoven University of Technology, The Netherlands |
| 8:20am | PS2-ThM2 In Situ Plasma Analysis and Sheath Modeling of Silicon Deep Trench Etching in Capacitively Coupled Dual Frequency HBr/NF3 Plasmas M. Reinicke, Dresden University of Technology, Germany, S. Wege, S. Barth, A. Steinbach, Qimonda Dresden, Germany, G. Wenig, A. Kersch, Qimonda Munich, Germany, J.W. Bartha, Dresden University of Technology, Germany |
| 8:40am | PS2-ThM3 Invited Paper Noninvasive Monitoring of Ion Current and Ion Energy during Plasma Processing M.A. Sobolewski, National Institute of Standards and Technology |
| 9:20am | PS2-ThM5 Application of an RF Biased Langmuir Probe to Etch Reactor Chamber Matching, Fault Detection and Process Control D.L. Keil, J.-P. Booth, N. Benjamin, C. Thorgrimsson, Lam Research Corporation, M. Brooks, San Jose State University / Lam Research Co., G. Curley, Ecole Polytechnique / Lam Research Co., L. Albarede, D. Cooperberg, Lam Research Corporation |
| 9:40am | PS2-ThM6 A New Diagnostic Method of Very High-Frequency Plasmas Produced in Insulated Vessels H. Shindo, K. Kusaba, Tokai University, Japan |
| 10:00am | PS2-ThM7 On-wafer Real Time Monitoring of Charge-Build-up Voltages during Plasma Etching in Production Equipment J. Hashimoto, Y. Yatagai, T. Tatsumi, S. Kawada, M. Konishi, I. Kurachi, Miyagi Oki Electric Co.,Ltd., Japan, Y. Ishikawa, S. Samukawa, Tohoku University, Japan |
| 10:20am | PS2-ThM8 In-Situ Wafer-Based Plasma Sensor Analysis in Inductively Coupled Plasmas M.J. Titus, D.B. Graves, University of California, Berkeley |
| 10:40am | PS2-ThM9 Plasma Process Development and Control with Real-Time Critical Process Parameter Detection at the Wafer Surface M.R. Tesauro, R. Koepe, T. Remus, Qimonda Dresden GmbH & Co. OHG, Germany, G.A. Roche, P. MacDonald, KLA-Tencor |