AVS 54th International Symposium
    Plasma Science and Technology Tuesday Sessions

Session PS1-TuA
Plasma Etching for Advanced Interconnects II

Tuesday, October 16, 2007, 1:40 pm, Room 606
Moderator: D.J. Economou, University of Houston


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Click a paper to see the details. Presenters are shown in bold type.

1:40pm PS1-TuA1
Process Performance of CO2 In Situ Photoresist Ashing Processes and Their Influence on ULK Materials Modifications
M.S. Kuo, G.S. Oehrlein, University of Maryland at College Park, S. Sirard, E.A. Hudson, Lam Research Corp.
2:00pm PS1-TuA2
SiOCH Damage in N2/H2 Plasma
M. Fukasawa, T. Tatsumi, K. Nagahata, Sony Corporation, Japan, S. Uchida, S. Takashima, M. Hori, Nagoya University, Japan, Y. Kamide, Sony Corporation, Japan
2:20pm PS1-TuA3
Study of Downstream O2 Plasma Damage to Blanket and Patterned CDO Low k Films
J. Bao, H. Shi, H. Huang, J. Liu, P.S. Ho, E. Paek, G.S. Hwang, The University of Texas at Austin
2:40pm PS1-TuA4
Ion- and Radical-Induced Ultra Low-k Damage Mechanisms
M.A. Goldman, S.H. Kim, D.B. Graves, University of California, Berkeley
3:00pm PS1-TuA5
Evaluation of Plasma Damages due to VUV Light, UV Light, Radicals, Ions and Interaction of Light and Radicals on Low-k Films
S. Uchida, S. Takashima, M. Hori, Nagoya University, Japan, M. Fukasawa, K. Oshima, K. Nagahata, T. Tatsumi, Sony Corporation, Japan
4:00pm PS1-TuA8
Low-Damage Low-k Etching by CF3I Plasma with Low Global Warming Potential
E. Soda, S. Kondo, Selete, Japan, Y. Ichihashi, A. Sato, H. Ohtake, S. Samukawa, Tohoku University, Japan, S. Saito, Selete, Japan
4:20pm PS1-TuA9
Ash Plasma Exposure of Hybrid Material (SiOCH and Porogen): Comparison with Porous SiOCH
M. Darnon, CNRS, France, T. Chevolleau, LTM-CNRS, France, T. David, CEA-LETI-MINATEC, France, L. Vallier, LTM-CNRS, France, J. Torres, STM, France, O. Joubert, LTM-CNRS, France
4:40pm PS1-TuA10
Effects of Combining H Radical Treatment and Low-k Restoration for Extreme Ultra Low-k
L.H. Chen, S. Tahara, Tokyo Electron AT LTD, Japan, R. Asako, Tokyo Electron LTD, Japan, K. Yamazaki, Tokyo Electron AT LTD, Japan, Y. Ohsawa, Tokyo Electron LTD, Japan, Y. Chiba, Tokyo Electron AT LTD, Japan, H. Nagai, Tokyo Electron LTD, Japan, K. Kubota, Tokyo Electron AT LTD, Japan, K. Maekawa, Tokyo Electron LTD, Japan
5:00pm PS1-TuA11
Process Induced Damages and Their Recovery for Highly-Porous Self-Assembled Porous Silica Low-k Film
K. Kinoshita, S. Chikaki, M. Nihei, Selete Inc., Japan, H. Tanaka, K. Kohmura, Mitsui Chemicals, Inc., Japan, T. Nakayama, ULVAC, Inc., Japan, T. Kikkawa, ASRC, AIST, Japan