AVS 54th International Symposium
    Thin Film Thursday Sessions
       Session TF-ThP

Paper TF-ThP26
Surface Modification of Polytetrafluoroethylene by Copper Ion Implantation

Thursday, October 18, 2007, 5:30 pm, Room 4C

Session: Aspects of Thin Films Poster Session
Presenter: K.-W. Weng, Mingdao University, Taiwan
Authors: K.-W. Weng, Mingdao University, Taiwan
S. Han, National Taichung Institute of Technology, Taiwan
Y.-C. Chen, National Chung Hsing University, Taiwan
D.-Y. Wang, Mingdao University, Taiwan
Correspondent: Click to Email

Polytetrafluorethylene (PTFE) was implanted copper by a hybrid metal plasma ion implantation (MPII) with varying ion dose. X-ray photoelectron spectroscopy (XPS) was used for the characterization of chemical structures in the ion-implanted assembly, while scanning electron microscopy (SEM) was used for the characterization of morphology. Five chemical bonds, CF3, CF2, CF, C-O, and elemental carbon bonds, were observed on the surface of the ion-implanted assembly. Numerous microfibers were observed on the ion-irradiated surface. Water contact angle of the ion-implanted samples increased gradually with increasing ion dose, and reached a maximum value of 103.50 on the surface of the sample implanted with ion dose of 3 × 1017 ion/cm2. The decrease of microhardness at high ion dose was resulted, accounted for radiation damage. Wear resistance and resistance were also discussed in the copper modified surface.