AVS 54th International Symposium | |
Applied Surface Science | Tuesday Sessions |
Session AS-TuA |
Session: | 3-Dimensional Characterization |
Presenter: | V.S. Smentkowski, General Electric Global Research |
Authors: | V.S. Smentkowski, General Electric Global Research S.G. Ostrowski, General Electric Global Research M.R. Keenan, Sandia National Laboratories J.A. Ohlhausen, Sandia National Laboratories P.G. Kotula, Sandia National Laboratories |
Correspondent: | Click to Email |
3 spatial dimension (3D) Time of Flight Secondary Ion Mass Spectrometry (ToF-SIMS) analysis can be performed if an X-Y image is saved at each depth of a depth profile. We will show how images reconstructed from specified depths, depth profiles generated from specific X-Y coordinates, as well as 3 spatial dimensional rendering provides for a better understanding of the sample than traditional depth profiling where only a single spectrum is collected at each depth. We will also demonstrate that multivariate statistical analysis (MVSA) tools can be used to perform a rapid, unbiased, analysis of the entire 3D data set. Color overlays of the MVSA components and animated movies showing the visualization (in 3D) from various angles will be provided. The MVSA results will also be represented as depth profile traces. 3D ToF-SIMS analysis is performed using only 1 primary ion shot/pixel. Under these conditions, detector dead time effects can introduce non-linearities into the data sets; examples of non-linear data sets will be shown. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000.