AVS 66th International Symposium & Exhibition | |
Advanced Surface Engineering Division | Thursday Sessions |
Session SE+PS-ThM |
Session: | Plasma-assisted Surface Modification and Deposition Processes |
Presenter: | David Boris, U.S. Naval Research Laboratory |
Authors: | D.R. Boris, U.S. Naval Research Laboratory A.C. Kozen, American Society for Engineering Education (residing at U.S. Naval Research Laboratory) S.G. Rosenberg, American Society for Engineering Education (residing at U.S. Naval Research Laboratory) J. del Hoyo, NASA Goddard Spaceflight Center J.G. Richardson, NASA Goddard Spaceflight Center M.A. Quijada, NASA Goddard Spaceflight Center S.G. Walton, U.S. Naval Research Laboratory |
Correspondent: | Click to Email |
Astronomical measurements in the Far Ultra-Violet (FUV, 90-200nm) require the use of aluminum thin films due to aluminum’s high reflectivity over this wavelength range. Unfortunately, the native aluminum oxide layer formed in atmosphere is strongly absorbing in this wavelength range, requiring that the aluminum films be passivated with a dielectric that inhibits oxidation. Due to the fast oxidation of aluminum, a simultaneous etch and deposition process is desirable to both eliminate the native aluminum oxide after growth and replace it with a different passivation coating layer. Optical measurements in the FUV range are some of the most challenging due to limited selection of low reflectivity coatings available for use on aluminum thin films. Typically magnesium fluoride (MgF2) or lithium fluoride (LiF) coatings are used for these passivation purposes but each has its problems. MgF2 has an absorption cutoff at 115 nm occluding a critical part of the FUV spectrum. LiF has a lower absorption cutoff at 102.5 nm, but is hygroscopic and thus susceptible to degradation in ambient conditions. A promising alternative to these coating materials is AlF3, which theoretically can provide reflectivity greater than 50% down to 100 nm if the coating is sufficiently thin. In this work, we explore the use of electron beam generated plasmas to simultaneously etch the native oxide layer from aluminum thin films while depositing an AlF3 capping layer to passivate the aluminum metal reflector. XPS measurements indicate that this approach is capable of producing very thin (<5 nm) AlF3 films with some mild (<10%) oxygen contamination. We will discuss the impact of plasma power, plasma chemistry, and plasma exposure time on the composition and structure of the passivation layer and how those parameters effect the optical properties. This work is partially supported by the Office of Naval Research, the Naval Research Laboratory base program, and NASA Strategic Astrophysics Technology (SAT) grant No. NNH177ZDA001N