AVS 66th International Symposium & Exhibition
    Manufacturing Science and Technology Group Wednesday Sessions
       Session MS-WeA

Invited Paper MS-WeA3
Precision 3D Solid State Battery Architectures: Science, Challenges and Manufacturing Opportunity

Wednesday, October 23, 2019, 3:00 pm, Room A226

Session: Science and Technology for Manufacturing: Solid State Batteries (ALL INVITED SESSION)
Presenter: Sang Bok Lee Lee, University of Maryland, College Park
Authors: S.B. Lee, University of Maryland, College Park
G.W. Rubloff, University of Maryland, College Park
Correspondent: Click to Email

This presentation describes recent findings related to the design and architectures of thin electrode materials synthesized by thin layer deposition techniques. Throughout the presentation I will describe how these techniques enable us to synthesize electrodes of interest with precise control over the structure and composition of the material. The electrochemical response of these thin electrodes will be discussed in the aspects of structural parameters, ion storage mechanism, interfacial electrochemical issues related to electrode degradation. While it is important to identify and understand mechanisms in performance and degradation, it is even more critical to design strategies and to mitigate challenging technical hurdles for developing means to implement and validate the strategies in the aspect of future manufacturing opportunity. For example, the design and the development process of precision 3D solid state battery architectures on a Si wafer will be discussed. In a nut shell, this talk illustrates how careful design of thin materials architecture can facilitate desirable electrochemical activity, resolve or shed light on mechanistic limitations of electrochemical performance in solid electrolyte systems, and eventually try to convince audience that the thin film processes using primarily existing semiconductor fabrication facilities may provide a new paradigm changing opportunity in solid state battery manufacturing technology.