AVS 66th International Symposium & Exhibition
    2D Materials Wednesday Sessions
       Session 2D+EM+MI+MN+NS+QS-WeM

Paper 2D+EM+MI+MN+NS+QS-WeM5
In-Plane Mechanical Properties and Strain Engineering of 2D Hybrid Organic-Inorganic Perovskites

Wednesday, October 23, 2019, 9:20 am, Room A226

Session: Novel 2D Materials
Presenter: Qing Tu, Northwestern University
Authors: Q. Tu, Northwestern University
I. Spanopoulos, Northwestern University
S. Hao, Northwestern University
C. Wolverton, Northwestern University
M. Kanatzidis, Northwestern University
G. Shekhawat, Northwestern University
V. Dravid, Northwestern University
Correspondent: Click to Email

Two-dimensional (2D) hybrid organic-inorganic perovskites (HOIPs) are new members of the 2D materials family with wide tunability, highly dynamic structural features and excellent physical properties. Mechanical strain is inevitable in 2D-HOIP-based applications due to materials processing, thermal expansion and substrate deformation. Understanding the mechanical properties and strain engineering of such functional materials are both fundamentally and practically important to achieve high performance and mechanically stable (flexible) devices. Here the in-plane mechanical properties and the impact of in-plane uniaxial tensile strain on the electronic properties of 2D lead iodide perovskites with a general formula (CH3(CH2)3NH3)2(CH3-NH3)n-1PbnI3n+1 were reported for the first time. The in-plane Young’s modulus and breaking strength of ultrathin 2D HOIP flakes were measured by AFM-based nanoindentation of suspended 2D HOIP membranes.[1] The in-plane Young’s moduli of 2D HOIPs are smaller than that of conventional covalently bonded 2D materials like graphene and MoS2 due to the much more deformable [PbI6]4- octahedra structure. Both the Young’s modulus and breaking strength first decrease and then plateau as the thickness of 2D HOIP flake increases from monolayer to 4 layers, which is attributed to interlayer slippage during deformation. Ultrathin 2D HOIPs exhibit outstanding breaking strength/Young’s Modulus ratio compared to many other widely used engineering materials and polymeric flexible substrates, which renders them suitable for application into flexible electronic devices. Furthermore, the uniaxial tensile strain was found to increase the band gap of 2D HOIPs.[2] Such strain effect on the band gap of 2D HOIPs is fully reversible and depends on the structural unit of the materials. For2D HOIP with n = 5, the strain response of the band gap can be as high as 13.3 meV/%. First-principles simulations show that the strain response of the band gap arises from the rotation of the inorganic [PbI6]4- octahedra and the consequential Pb-I bond stretching and increase of Pb-I-Pb angle. The observed band gap–strain relationship can be harnessed to map the local mechanical strain in 2D HOIP-based devices and allow 2D HOIPs for sensing applications.

References

[1]. Tu Q, Spanopoulos I, Yasaei P, Stoumpos CC, Kanatzidis MG, Shekhawat GS, et al. Stretching and Breaking of Ultrathin 2D Hybrid Organic–Inorganic Perovskites. ACS Nano. 2018;12(10):10347-54.

[2]. Tu Q, Spanopoulos I, Hao S, Wolverton C, Kanatzidis MG, Shekhawat GS, et al. Probing Strain-Induced Band Gap Modulation in 2D Hybrid Organic–Inorganic Perovskites. ACS Energy Letters. 2019;4(3):796-802.