| AVS 66th International Symposium & Exhibition | |
| 2D Materials | Monday Sessions |
| Session 2D+AP+EM+MI+MN+NS+PS+TF-MoA |
| Session: | Nanostructures including Heterostructures and Patterning of 2D Materials |
| Presenter: | Vu Nguyen, University of California at Berkeley |
| Authors: | V. Nguyen, University of California at Berkeley H. Taylor, University of California at Berkeley |
| Correspondent: | Click to Email |
One of the major challenges of van der Waals (vdW) integration of 2D materials is the high-yield and -throughput assembly of pre-defined sequence of monolayers into heterostructure arrays. Although a variety of techniques have been developed to exfoliate the 2D materials from the source and deterministically place them onto a target substrate, they typically can transfer only either a wafer-scale blanket or a small flake at a time with uncontrolled size and shape. Here we present a method to exfoliate arrays of lithographically defined monolayer MoS2 and WS2 features from multilayer sources and directly transfer them in a deterministic manner onto target substrates. The continuous exfoliate-align-release process, without the need of an intermediate carrier substrate, was enabled by a new transfer medium fabricated by spin-coating a low-crosslinked and transparent adhesive on a transparent, electrostatically active backing material with low surface energy. MoS2/WS2 vdW heterostructure arrays produced by this method were characterized, showing coupled photoluminescence between the monolayers. Light-emitting devices using WS2 monolayer were also demonstrated, proving the functionality of the fabricated materials. This method promises to produce large-area monolayer and multiplex heterostructure arrays with capability to integrate with existing semiconductor manufacturing equipment.