AVS 65th International Symposium & Exhibition
    Thin Films Division Wednesday Sessions
       Session TF+EM+MI-WeA

Paper TF+EM+MI-WeA3
Low-temperature Homoepitaxial Growth of Two-dimensional Antimony Superlattices in Silicon

Wednesday, October 24, 2018, 3:00 pm, Room 102A

Session: Thin Film Processes for Electronics and Optics II
Presenter: April Jewell, Jet Propulsion Laboratory
Authors: A.D. Jewell, Jet Propulsion Laboratory
M.E. Hoenk, Jet Propulsion Laboratory
A.G. Carver, Jet Propulsion Laboratory
S. Nikzad, Jet Propulsion Laboratory
Correspondent: Click to Email

Our group has previously reported on the growth of antimony delta-doped silicon by low-temperature molecular beam epitaxy. In this presentation we will discuss the extension of our antimony delta doping capabilities to the growth of n-type superlattices (i.e. films that incorporate multiple delta layers). We will discuss details related to growth optimization, and show results from in situ monitoring by Auger electron spectroscopy and electron diffraction. We will also report on electrical characterization of our films and preliminary device measurements.

JPL’s delta doping and superlattice doping (i.e., two-dimensional “2D” doping) processes have been developed primarily for use with silicon-based scientific imagers. A key performance metric for these detectors is photometric stability, a parameter that depends largely on passivation at the detector interface. Our approach uses an atomically thin (2D), highly concentrated layer of dopant atoms embedded within nanometers of the surface. This allows for dopant concentrations in the range of 1013-1014 cm-2 (1020-1021 cm-3); higher than can be achieved with 3D doping techniques. Resulting quantum effects within the highly-doped 2D layers result in exceptional stability in 2D-doped devices.

N-type 2D-doping with antimony is challenging primarily because it tends to segregate to the surface. Segregation is suppressed at low temperatures; however, this may compromise epitaxial growth and lead to poor dopant incorporation and activation. Even so, it has been shown that at sufficiently slow silicon deposition rates it is possible to maintain epitaxial growth even at low temperatures for finite thicknesses. In our previous work with single n-type delta layers, we demonstrated activated dose concentrations as high as 2×1014 cm-2 and sharp dopant profiles (~35 Å FWHM). Under the current effort we have further optimized our growth processes to achieve even sharper dopant profiles and multiple delta layers. This is enabled by switching from a standard effusion cell to a valved cracker cell for antimony evaporation, which allows for high atom and carrier densities on the order of ~1021 cm-3 with peak distribution at ~10 Å FWHM.

The performance of our low-temperature 2D-doping processes has been validated by applying both p-type and n-type superlattice-doping to fully depleted photodiodes. The superlattice-doped devices show significantly higher responsivity than the equivalent ion-implanted devices. Additionally, when exposed to pulsed X-rays the superlattice-doped devices exhibit fast response and recovery times required for use in pulsed power experiments.

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