| AVS 65th International Symposium & Exhibition | |
| Advanced Surface Engineering Division | Tuesday Sessions |
| Session SE-TuP |
| Session: | Advanced Surface Engineering Division Poster Session |
| Presenter: | Michelle Paquette, University of Missouri-Kansas City |
| Authors: | M.M. Paquette, University of Missouri-Kansas City R. Thapa, University of Missouri-Kansas City L. Dorsett, University of Missouri-Kansas City S. Malik, University of Missouri-Kansas City S. Wagner, University of Missouri-Kansas City A.N. Caruso, University of Missouri-Kansas City D. Merrill, Intel Corporation J.D. Bielefeld, Intel Corporation S.W. King, Intel Corporation |
| Correspondent: | Click to Email |
Thiol-carborane self-assembled monolayers (SAMs) have been used to modify the properties of metal surfaces. Not only do the symmetric twelve-vertex icosahedral carborane molecules provide a unique and appealing geometry for SAM formation, but boron carbide materials are notorious for their chemical, thermal, and mechanical robustness. Carborane-based SAMs have been shown to provide superior corrosion resistance on silver as well as the ability to modify the electronic properties (e.g., work function) of gold and silver surfaces. One of the noteworthy properties of carboranes is their ability to cross-link via labile hydrogen bonds under the influence of heat, plasma, and various energetic particles. Here, we investigate the influence of various plasma treatments on carborane monolayers on copper and show how these can be used to both further tune their properties as well as influence their stability.