AVS 65th International Symposium & Exhibition
    Advanced Surface Engineering Division Tuesday Sessions
       Session SE+PS-TuM

Paper SE+PS-TuM4
Experimental and Numerical Evaluation of Cohesive and Adhesive Failure Modes during Indentation of TiAlN Coatings on Si(100) Deposited by MPPMS

Tuesday, October 23, 2018, 9:00 am, Room 202C

Session: Plasma-assisted Surface Modification and Deposition Processes
Presenter: Z.T. Jiang, Dalian University of Technology, China
Authors: Z.T. Jiang, Dalian University of Technology, China
M.K. Lei, Dalian University of Technology, China
Correspondent: Click to Email
The mechanical behavior of TiAlN coatings was studied by Indentation test and FEM modeling. The TiAlN coatings were deposited by modulated pulse power (MPP) magnetron sputtering. The peak power was used from 21 kW to 50 kW with the gas flow ratio of Ar/N2=4:1. The microstructure of the indented regions was observed by focused ion beam (FIB), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). XRD with grazing angle of incidence reveals that the coatings consisted with c-TiAlN. The achieved hardness and modulus for the coatings show significant increase from 23.6 GPa to 46.7 GPa and 396 GPa to 461 GPa. The eXtended Finite Element Method (XFEM) was applied to study the cohesive cracks through the coatings, while the Cohesive Zone Model (CZM) was to evaluate the coating/substrate interfacial crack. The stress transfer from the coating to the substrate was dependent on the elastic and elastic/plastic properties of the coating and substrate. The energy release rate of the coating and the cohesive zone parameters were investigated by the fracture toughness of the coatings. Compared with the experimental results, the simulation results were able to accurately observe the deformation as well as the fracture behavior of the coatings. Under indentation loading, the crack initiation tended to begin at the outer surface and to propagate along the coating in thickness direction until the cracks reached the substrate.